1、 High precision measurement principle

　　3D composite image measuring instrumentAdopting advanced optical imaging and geometric operation techniques. Obtain images of the tested object through high-resolution cameras and transmit them to a computer for processing. Computers extract the contours and feature points of objects based on the images captured by cameras, and then use geometric operation techniques to calculate the size, shape, and positional relationship of objects. In addition, some instruments are equipped with laser rangefinders, which measure the distance between the laser and the object by emitting a laser beam, thus achieving three-dimensional measurement.

　　2、 Applications in the electronics industry

In the electronics industry, 3D composite image measuring instruments are widely used in multiple key fields:

1. Printed Circuit Board (PCB) Inspection: Measure the pads, lines, and holes on the PCB to ensure they meet the design specifications.

2. Electronic component testing: Precise measurement of the size, position, and pin spacing of electronic components to ensure product reliability and stability.

3. Smartphone and tablet component testing: BQ Company has been using the Optiv Classic 432 composite image measuring instrument produced by Hexagon Manufacturing Intelligence Company for quality testing of its smartphones, tablets, and other devices since 2015.

4. LED chip packaging process: Power Boshi's PF-GMS series size measuring instrument performs well in LED chip packaging process, capable of automatically capturing product boundaries and surface features, with higher measurement efficiency.

　　3、 Technological advantages and innovation

The 3D composite image measuring instrument not only achieves high-precision measurement, but also has various innovative functions:

1. Automatic measurement function: CNC coordinate data is established through sample measurement, drawing calculation, CNC data import, and other methods. Then, the instrument automatically measures the target point and completes various measurement operations.

2. Multiple sensor configurations: Supports both contact and non-contact measurements, such as trigger probes, point lasers, triangle lasers, etc., to meet different measurement needs.

3. Intelligent AI automatic edge finding technology: Combined with intelligent AI technology, it can automatically identify and measure small features, reducing human errors.

　　4、 The impact on the electronics industry

The emergence of 3D composite image measuring instruments has greatly improved the production efficiency and product quality of the electronics industry. It can not only measure small sizes quickly and accurately, but also maintain high precision and stability in complex environments. In addition, its automatic measurement function and multiple sensor configurations make the measurement process more efficient and flexible. With its excellent performance and wide range of applications, it is becoming a key tool for achieving precise measurement of small sizes in the electronics industry.