MINI high-speed cameraThrough four core technologies of sensor miniaturization design, customized chip processing, microsecond level exposure control, and compact optical system, the ability to capture millions of frames per second has been achieved in a small volume, while also considering heat dissipation, storage, and portability, making it an ideal tool for micro experiments, industrial testing, and other scenarios. The following is a specific technical analysis:

1. Sensor miniaturization: CMOS backlit structure and global shutter technology

Back illuminated CMOS: By placing the photodiode behind the circuit layer, the light transmission path is reduced and the photosensitive efficiency is improved.

Global shutter technology: Compared to traditional rolling shutter shutter, global shutter can simultaneously expose all pixels, eliminating the jelly effect during high-speed motion.

2. Customized chip processing: ASIC and NPU collaborative optimization

Low power ASIC chip: customized application specific integrated circuits (ASICs) for high-speed data processing requirements, reducing power consumption while reducing size.

NPU edge computing: some models integrate neural network processors (NPUs) to achieve localized image analysis.

3. Microsecond level exposure control: balance short exposure and high frame rate

Nanosecond exposure time: By optimizing sensor timing control, extremely short exposure can be achieved.

Dynamic frame rate adjustment: Flexibly adjust the frame rate according to scene requirements. For example, when observing water droplet collisions, it is possible to switch to 2000fps to capture details of droplet splashing; When monitoring pipeline defects, reduce to 500fps to extend storage time.

4. Compact optical system: small aperture objective lens and folded optical path

Small aperture objective lens design: using high refractive index glass and multi-layer coating technology to reduce the size of the objective lens while maintaining imaging quality.

Folding optical path structure: Folding the optical path through mirrors or prisms to reduce the thickness of the body.

5. Heat dissipation and storage optimization: fanless design and large capacity memory

Fanless enclosed body: Passive heat dissipation is achieved by conducting heat to the body shell through thermal conductive silicone grease and heat dissipation fins.

Large capacity high-speed storage: comes standard with 16GB-64GB memory and supports expansion to 4TB, meeting long-term continuous shooting needs.