The BGA coplanarity testing instrument has a beautiful and elegant structure, and is easy to operate. Combined with our company's measurement software, it can achieve accurate measurement of component coplanarity, workpiece external dimensions, etc. It has high cost-effectiveness, strong scalability, comprehensive functions, and can meet various conventional measurement needs.

detailed introduction

Product Introduction of BGA Coplanarity Tester

By scanning the surface of the chip with solder balls or the pin surface on the IC using a line laser, three-dimensional point set data is collected and processed by software to generate a 3D shape of the workpiece. The software algorithm extracts the high or low points of each solder ball in the 3D image, and then generates a plane using all the high or low points. The flatness value is calculated as the coplanarity of the solder balls or pins. The equipment adopts a fixed gantry XYZ three-axis motion structure, and the internal main frame is made of marble, which can ensure a stable mechanical structure. The tray and the measured workpiece can be placed on the workbench glass and moved back and forth to the measurement area. The combination of line scanning laser head and visual objective lens can scan and measure along the left and right movement, and can be focused up and down to adapt to measurements at different heights.

Application of BGA coplanarity tester products

Widely used in coplanarity testing of crystal elements, chips (DIP, SOP, QFP, QFN, BGA, LGA, PGA), and other industries such as mechanical manufacturing, electronics, automotive, hardware, plastics, molds, etc., it can accurately detect the size, shape, and positional tolerances of workpieces, thereby completing tasks such as automatic picking, automatic sorting, part inspection, shape measurement, and process control.