JK-HHP1500 modelMicrofluidic chip hot stamping machine

Keywords: microfluidics, hot pressed chips,COC/COP

Main purpose:1) COC/COP/PMMA/PS and other plasticsMicrofluidic chip hot stamping forming

2）Hot pressing sealing of plastic microfluidic chips

1. Introduction to COC/COP/PMMA/PS and other plastic microfluidic chip embossing and bonding machines

In the field of microfluidics, commonly used chip materials includePDMS、 Glass, PMMA, PC, COC, COP plastics, etc. Each material has different performance characteristics and advantages, among which PDMS and glass materials can be processed with MEMS technology to form structures with a width of several microns or more and at a lower cost. For plastic materials, if CNC machining is used, general equipment can only process structures with a line width of 100um or more. If you want to process structures within 100um, you need to open a mold for injection molding, which is costly. Especially for customers whose chip structure has not been finalized, repeatedly modifying the injection mold is costly, and the product development cycle is also extended.

So, is there a low-cost and efficient way to process plastic chips? The answer is affirmative. Jingke Zhichuang has developed chip hot stamping technology to solve the above problems. It uses independently developed resin molds to imprint plastic light sheets, without the need for injection molding metal molds, and can process the smallest sizeA plastic chip with a line width of 20um. Jingke Zhichuang not only provides outsourcing services for chip hot stamping, but also offers equipment construction solutions and process training for chip stamping processes, assisting customers in quickly obtaining microfluidic chip samples.

2. JK-HHP1500 Chip Embossing MachinePerformance Characteristics

(1) The PID constant temperature control heating technology used has precise temperature control, with a temperature sampling frequency of 0.1s and accurate and stable temperature;

(2) Adopting aviation aluminum heating working platform, with flat upper and lower surfaces, fast thermal conductivity, and uniform temperature;

(3) The heating area of the upper and lower plates is large, meeting the common chip size requirements;

(4) Automatic cooling system, using air cooling for uniform cooling rate, which is conducive to achieving better embossing effect (with reserved water cooling interface to meet the requirements of rapid cooling process);

(5) The pressure is precisely adjustable, and different imprinting pressures are selected for different materials;

(6) The vacuum hot pressing system used significantly improves the success rate of embossing;

(7) It has two operation modes: manual mode and automatic mode. The automatic mode can save 20 sets of parameters, and each set can set 10 temperature control parameters, which is convenient for customers to operate and improves embossing efficiency.

3JK-HHP1500 Chip Embossing Machineperformance parameters