MOCON supports the 5th China Youth Packaging Innovation and Development Forum

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Date: 2023-08-07Read: 1

On August 17-18, 2023, the 5th China Youth Packaging Innovation and Development Forum (PDF-2023) will be held at the Shanghai Hongqiao Xijiao Manor Hotel.

The theme of this conference is "Promoting Sustainable Development and Innovation of Packaging under the Background of Dual Carbon". According to the organizer, this forum will gather middle and senior level managers from various packaging industry chains to explore packaging innovation, sustainable packaging, and the development trends of the packaging industry, promoting in-depth communication and resource optimization between the upstream and downstream of the packaging industry.

In order to assist young students in pursuing innovative packaging dreams and create a better future for packaging together. MOCON strongly sponsors the 5th China Packaging Innovation Scholarship and will attend the forum on August 18th as a guest speaker to discuss and share the future of sustainable development and innovation in packaging with the attendees.

MOCON keynote speech:Optimize your packaging technology and extend shelf life

Time: August 18th, 11:00-11:30 AM

Speaker: He Zhiyong (Sales and Marketing Director of MOCON Asia Pacific)

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